Description

Thin thermal pad (2.5 mm) for use with the HOT300 Large Backplate. Suitable for when there’s enough height clearance on the PCB such as on most graphics cards.

Specification

• Dimensions 150 x 100 x 2.5 mm
• Thermal Conductivity 6 W/mK
• Continuous Temperature Usage -40 to 200 °C
• Volume Resistivity > 100 GΩcm
• Dielectric Breakdown Voltage > 5 kV